Samsung and TSMC, the leading chipmakers, have announced their plans to utilize ASML's High NA extreme ultraviolet (EUV) lithography machines, which are essential for producing advanced chips. Samsung intends to start using these machines for DRAM production by 2028, while TSMC will employ them for advanced chip manufacturing, driven by the complexities of AI transistor architectures.
The High NA machines, valued at approximately $400 million each, are expected to enhance efficiency and extend the DRAM scaling roadmap. ASML's stock has seen a remarkable 120% increase over the past year, and analysts from Barclays view this commitment as a positive indicator for ASML's growth prospects.
They noted that the announcements provide greater visibility into the adoption of these machines, which has been a topic of debate. Additionally, both companies will collaborate with ASML on advancing next-generation 12-inch photomask technology, which is crucial for chip production. This shift from the current 6-inch format aims to improve productivity and reduce manufacturing costs.
ASML has not specified sales forecasts for the High NA machines but plans to increase its EUV capacity by about 30% by 2027, indicating strong demand in the market